3M Thermal Bonding Film 588
Flexible, 100 Percent Solids, Heat Activating Dry Film Adhesive is Composed of a Higher Ratio of Thermosetting Resins than 583 for High Internal Strength and Structural Type Bonds.
Key Characteristics
- High strength and flexibility for durable bonding.
- Can be activated using either heat or solvent.
- Thicker version of the 3M Thermal Bonding Film 583, for enhanced applications.
- Suitable for splicing glass fabric in PCB manufacturing.
- Option to be crosslinked post heat exposure for additional stability.
- Can be die-cut to fit specific shapes and sizes.
Recommended Applications
- Splicing and bonding in PCB board manufacturing.
- Applications requiring strong, flexible adhesive films.
- Industrial processes where heat or solvent activated bonding is needed.
- Manufacturing scenarios requiring customized adhesive shapes.
Flexible, 100 Percent Solids, Heat Activating Dry Film Adhesive is Composed of a Higher Ratio of Thermosetting Resins than 583 for High Internal Strength and Structural Type Bonds.
