The 3M™ Thermal Bonding Film 588 is an advanced adhesive film developed to provide strong and durable bonding in various industrial applications. As a thicker variant of the 3M™ Thermal Bonding Film 583, it retains all the advantageous properties of its counterpart while offering enhanced performance characteristics due to its increased thickness. This nitrile phenolic based thermosetting adhesive is particularly suited for tasks such as splicing glass fabric during PCB board manufacturing.
- Increased Flexibility: Despite its thicker design, the film remains highly flexible, accommodating various substrates and complex bonding contours.
- Heat or Solvent Activation: This film can be activated using either heat or solvents, providing versatility in application methods to suit different production environments and requirements.
- Die-Cutting Capability: The ability to be die-cut into precise shapes and sizes makes it ideal for specific applications, ensuring a perfect fit and optimal performance in specialized manufacturing processes.
- Heat Crosslinkable: The option to be lightly crosslinked through post-heat exposure enhances its thermal stability and bond strength, making it more durable under high-temperature conditions.
Usage and Maintenance: For optimal use of 3M™ Thermal Bonding Film 588, it is essential to ensure that surfaces are clean and free from contaminants before application. Proper handling during heat or solvent activation is crucial to achieve a strong, durable bond. Monitoring the temperature and curing time will ensure that the film is activated correctly without damaging the substrates. Regular checks of bonded areas are recommended to assess the integrity and durability of the bonds, especially in high-stress applications.
Product ID: 3M 588 UPC: 00-021200-43775-5, 00021200437755 Stock ID: 62-0037-4101-4, 62003741014
Units per Pallet : 50 Rolls
Harmonizing Code : 3506910000
ECCN : EAR99