This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Description
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
