3M Thermal Bonding Film AF42, 3 in x 72 yd, 13 per case, 3 mil

The 3M™ Thermal Bonding Film AF42 is a high-performance epoxy thermoset film adhesive, specifically developed for structural bonding in electronics applications involving metal, glass, and other engineering-grade materials. Its robust characteristics make it well-suited for use in environments where durability and strength are paramount.

• High-Temperature Cure: The adhesive cures at a temperature of 177°C (350°F), allowing for a strong, durable bond suitable for high-temperature applications common in electronic manufacturing.
• High Peel Strength: AF42 is designed to provide tough bonding with high peel strength, which is crucial for enduring the mechanical stresses that occur in electronic device operations.
• Storage Requirements: To maintain its chemical properties, the film must be stored at or below 4°C (40°F). Proper storage is essential to prevent premature curing or degradation of the adhesive properties.
• No Tack, Low Flow: This film features a no-tack, low flow characteristic, which minimizes mess and waste during application, making it easier to handle and apply precisely without adhesive spreading beyond the intended area.
• Cures Clear: Upon curing, the film becomes clear, which is beneficial for maintaining the aesthetic qualities of the bonded materials, especially in visible areas of electronic devices.

Usage and Maintenance: Ensure that the 3M™ Thermal Bonding Film AF42 is applied to clean, dry, and properly prepared surfaces for optimal bonding performance. The lack of tack and low flow properties require careful placement and minimal pressure during application to form a correct bond without displacement. Regular inspections of bonded areas should be performed to ensure ongoing adhesion and integrity, especially in critical electronic applications. Keep the adhesive stored as recommended to preserve its quality over time.

Product ID: 3M AF42 UPC: 00-021200-20319-0, 00021200203190 Stock ID: 62-2197-1701-4, 62219717014